Synopsys and Intel Foundry Fast-Track Customer Readiness from Silicon to Systems on Intel 14ACertified AI-powered EDA flows, integrated multiphysics analysis, and broad IP portfolio accelerate Angstrom-scale AI and multi-die designs Key Highlights Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs: Provide early insight into power integrity, thermal, and electromagnetic effects, improving predictability and accelerating convergence From DTCO to system-aware co-optimization: Extends co-optimization across silicon, package, IP and system domains to enable full system realization with optimal PPA Multi-die and advanced packaging leadership: Synopsys 3DIC Compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs Broad IP portfolio for faster time-to-tapeout: Interface and Foundation IP for Intel 14A — including PCIe 7.0, 224G SerDes, USB 4 and eUSB reduce integration risk and accelerate design readiness SUNNYVALE, Calif., July 27, 2026 /PRNewswire/ -- Synopsys, Inc. (Nasdaq: SNPS) today announced at the 2026 DAC Chips to Systems Conference , expanded collaborations with Intel Foundry with the certification of AI-powered EDA flows on Intel 14A process technology, advancing design enablement from design technology co-optimization (DTCO) to system-aware co-design, building on its certified and production-ready EDA flows and IP portfolio for Intel 18A and Intel 18A-P technologies.
PRNewsWire7/27/2026Neutral